Öncelikle çok teşekkür ederim. Değerler bu şekilde. 1. slot 4 gb var. Diğerine 8 gb ram takmak istiyorum. Attığınız SSD linklerine baktım onlardan birini tercih edeceğim. Umarım laptop şu ankinden hızlı olur.
Item
Slot #1
Slot #2
Ram Type
DDR4
Not Populated
Maximum Clock Speed (MHz)
1200 (JEDEC)
Maximum Transfer Speed (MHz)
DDR4-2400
Maximum Bandwidth (MB/s)
PC4-19200
Memory Capacity (MB)
4096
Jedec Manufacture Name
SK Hynix
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SPD Revision
1.1
Registered
No
ECC
No
DIMM Slot #
1
Manufactured
Week 24 of Year 2017
Module Part #
HMA851S6AFR6N-UH
Module Revision
0x0
Module Serial #
0x29CC120D
Module Manufacturing Location
1
# of Row Addressing Bits
16
# of Column Addressing Bits
10
# of Banks
8
# of Ranks
1
Device Width in Bits
16
Bus Width in Bits
64
Module Voltage
1.2V
CAS Latencies Supported
10 11 12 13 14 15 16 17 18
Timings @ Max Frequency (JEDEC)
17-17-17-39
Maximum frequency (MHz)
1200
Maximum Transfer Speed (MHz)
DDR4-2400
Maximum Bandwidth (MB/s)
PC4-19200
Minimum Clock Cycle Time, tCK (ns)
0.833
Minimum CAS Latency Time, tAA (ns)
13.750
Minimum RAS to CAS Delay, tRCD (ns)
13.750
Minimum Row Precharge Time, tRP (ns)
13.750
Minimum Active to Precharge Time, tRAS (ns)
32.000
Minimum Row Active to Row Active Delay, tRRD (ns)
5.300
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns)
45.750
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns)
350.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns)
1.600
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns)
260.000
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns)
160.000
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns)
5.300
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns)
6.400
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns)
5.000
Minimum Four Activate Window Delay (ns)
30.000
Maximum Activate Window in units of tREFI
8192
Thermal Sensor Present
No
DRAM Stepping
255
DRAM Manufacture
SK Hynix
SDRAM Package Type
Monolithic, 1 die, Single load stack
Maximum Activate Count (MAC)
Unlimited MAC
Post Package Repair Supported
Yes
Module Type
SO-DIMM
Module Height (mm)
30
Module Thickness (front), (mm)
2
Module Thickness (back), (mm)
1
Reference Raw Card Used
Raw Card C Rev. 15