RE: Cvp: G-Skill Aegis RAM'e hangi RAM uyumlu olur?
ugur.gozaydin' Alıntı:
Baz DDR4 frekansında bir bellek kullandığınız için çok fazla bir şeye dikkat etmeniz gerekmiyor. Her DDR4 bellek eğer marka kilitlemediyse zaten 2133MHz hızda çalışır. Ama en az sorun için
PassMark RAM SPD data retrieval tool şu aracı indirip EXPORT seçeneğinden bellek bilgilerinizi bizimle ya doküman yada resim olarak paylaşın. Bellek bilgilerine göre öneri yapmak daha doğru olur.
Şöyle iletiyim size :
RAMMon v2.0 Build: 1000 built with SysInfo v2.3 Build: 1000
PassMark (R) Software
www.passmark.com
Memmory summary for DESKTOP-CAV2ACB:
Number of Memory Devices: 1 Total Physical Memory: 8137 MB (8192 MB)
Total Available Physical Memory: 4270 MB
Memory Load: 47%
Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 |
--------------------------------------------------------------------------------------|----------------------------------------|-----------------|-----------------|-----------------|-
Ram Type | DDR4 | Not Populated | Not Populated | Not Populated |
Maximum Clock Speed (MHz) | 1067 (JEDEC) | | | |
Maximum Transfer Speed (MHz) | DDR4-2133 | | | |
Maximum Bandwidth (MB/s) | PC4-17000 | | | |
Memory Capacity (MB) | 8192 | | | |
Jedec Manufacture Name | G Skill Intl | | | |
Search Amazon.com | Search! | | | |
SPD Revision | 1.0 | | | |
Registered | No | | | |
ECC | No | | | |
On-Die ECC | No | | | |
DIMM Slot # | 1 | | | |
Manufactured | | | | |
Module Part # | F4-2133C15-8GIS | | | |
Module Revision | 0x1 | | | |
Module Serial # | 0x0 | | | |
Module Manufacturing Location | 0 | | | |
# of Row Addressing Bits | 15 | | | |
# of Column Addressing Bits | 10 | | | |
# of Banks | 16 | | | |
# of Ranks | 2 | | | |
Device Width in Bits | 8 | | | |
Bus Width in Bits | 64 | | | |
Module Voltage | 1.2V | | | |
CAS Latencies Supported | 9 11 12 13 14 15 16 18 19 | | | |
Timings @ Max Frequency (JEDEC) | 15-15-15-35 | | | |
Maximum frequency (MHz) | 1067 | | | |
Maximum Transfer Speed (MHz) | DDR4-2133 | | | |
Maximum Bandwidth (MB/s) | PC4-17000 | | | |
Minimum Clock Cycle Time, tCK (ns) | 0.938 | | | |
Minimum CAS Latency Time, tAA (ns) | 13.500 | | | |
Minimum RAS to CAS Delay, tRCD (ns) | 13.500 | | | |
Minimum Row Precharge Time, tRP (ns) | 13.500 | | | |
Minimum Active to Precharge Time, tRAS (ns) | 32.000 | | | |
Minimum Row Active to Row Active Delay, tRRD (ns) | 3.700 | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 46.500 | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 260.000 | | | |
| | | | |
DDR4 Specific SPD Attributes | | | | |
Maximum Clock Cycle Time, tCKmax (ns) | 1.500 | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 160.000 | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 110.000 | | | |
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.700 | | | |
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 5.300 | | | |
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.355 | | | |
Minimum Four Activate Window Delay (ns) | 21.000 | | | |
Maximum Activate Window in units of tREFI | 8192 | | | |
Thermal Sensor Present | No | | | |
DRAM Stepping | 1 | | | |
DRAM Manufacture | SK Hynix | | | |
SDRAM Package Type | Monolithic, 1 die, Single load stack | | | |
Maximum Activate Count (MAC) | Unlimited MAC | | | |
Post Package Repair Supported | No | | | |
Module Type | UDIMM | | | |
Module Height (mm) | 32 | | | |
Module Thickness (front), (mm) | 2 | | | |
Module Thickness (back), (mm) | 2 | | | |
Reference Raw Card Used | Raw Card B Rev. 17 | | | |