Item | Slot #1 | Slot #2 |
---|
Ram Type | DDR4 | Not Populated |
Maximum Clock Speed (MHz) | 1502 (XMP) | |
Maximum Transfer Speed (MHz) | DDR4-3003 | |
Maximum Bandwidth (MB/s) | PC4-24000 | |
Memory Capacity (MB) | 8192 | |
Jedec Manufacture Name | Crucial Technology | |
Search Amazon.com | Search! | |
SPD Revision | 1.1 | |
Registered | No | |
ECC | No | |
On-Die ECC | No | |
DIMM Slot # | 1 | |
Manufactured | Week 29 of Year 2019 | |
Module Part # | BLS8G4D30AESEK.M8FE | |
Module Revision | 0x0 | |
Module Serial # | 0xE25CA824 | |
Module Manufacturing Location | 0 | |
# of Row Addressing Bits | 16 | |
# of Column Addressing Bits | 10 | |
# of Banks | 16 | |
# of Ranks | 1 | |
Device Width in Bits | 8 | |
Bus Width in Bits | 64 | |
Module Voltage | 1.2V | |
CAS Latencies Supported | 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 | |
Timings @ Max Frequency (JEDEC) | 16-16-16-39 | |
Maximum frequency (MHz) | 1200 | |
Maximum Transfer Speed (MHz) | DDR4-2400 | |
Maximum Bandwidth (MB/s) | PC4-19200 | |
Minimum Clock Cycle Time, tCK (ns) | 0.833 | |
Minimum CAS Latency Time, tAA (ns) | 13.320 | |
Minimum RAS to CAS Delay, tRCD (ns) | 13.320 | |
Minimum Row Precharge Time, tRP (ns) | 13.320 | |
Minimum Active to Precharge Time, tRAS (ns) | 32.000 | |
Minimum Row Active to Row Active Delay, tRRD (ns) | 3.000 | |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 45.320 | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 350.000 | |
| | |
DDR4 Specific SPD Attributes | | |
Maximum Clock Cycle Time, tCKmax (ns) | 1.600 | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | |
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.000 | |
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 4.900 | |
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.000 | |
Minimum Four Activate Window Delay (ns) | 21.000 | |
Maximum Activate Window in units of tREFI | 8192 | |
Thermal Sensor Present | No | |
DRAM Stepping | 0 | |
DRAM Manufacture | Micron Technology | |
SDRAM Package Type | Monolithic, 1 die, Single load stack | |
Maximum Activate Count (MAC) | Unlimited MAC | |
Post Package Repair Supported | No | |
Module Type | UDIMM | |
Module Height (mm) | 32 | |
Module Thickness (front), (mm) | 2 | |
Module Thickness (back), (mm) | 2 | |
Reference Raw Card Used | Raw Card A Rev. 18 | |
| | |
XMP Attributes | | |
XMP Revision | 2.0 | |
Enthusiast / Certified Profile | | |
Module voltage | 1.35V | |
Clock speed (MHz) | 1502 | |
Transfer Speed (MHz) | DDR4-3003 | |
Bandwidth (MB/s) | PC4-24000 | |
Minimum clock cycle time, tCK (ns) | 0.666 | |
Supported CAS latencies | 7 8 9 10 11 12 13 14 15 16 17 18 19 20 | |
Minimum CAS latency time, tAA (ns) | 9.875 | |
Minimum RAS to CAS delay time, tRCD (ns) | 10.625 | |
Minimum row precharge time, tRP (ns) | 10.625 | |
Minimum active to precharge time, tRAS (ns) | 23.250 | |
Supported timing at highest clock speed | 15-16-16-35 | |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 45.375 | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC1 (ns) | 350.000 | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | |
Minimum Four Activate Window Delay, tFAW (ns) | 21.000 | |
Minimum Activate to Activate Delay Time different bank group, tRRD_S (ns) | 3.000 | |
Minimum Activate to Activate Delay Time same bank group, tRRD_L (ns) | 4.900 | |